More competition, business uncertainty, and much more difficult manufacturing processes when 3D NAND scales vertically.

The next challenge in tier stacking is the alignment of the final hole. The industry uses overlay, registration, alignment, misalignment, mis-registration and similar words to describe the relative ...

Memory chip giants are upping the ante on each other with new generations of 3D NAND flash. 3D NAND chips resemble skyscrapers in which floors of flash-memory cells are stacked on top of each other.

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it.

While innovations in 3D NAND flash aim at high-density storage, 3D FeFET memory is a viable candidate for low-latency applications.

South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND. YMTC continues ...

Yangtze Memory Technologies Co. (YMTC) has quietly started to ship its 5th-Gen 3D NAND memory with 294 layers in total as well as 232 active layers, and analysts from TechInsights have managed to ...

The synergy of utilizing the same processes and equipment for the two memory types - DRAM and NAND - was completely gone, and the core of competitive strategies in the memory industry changed.

SanDisk talks high bandwidth flash memory that promises to wed HBM bandwidth with 3D NAND capacity.

The introduction of new SSDs built on Samsung's TLC 3D NAND flash technology brings the cost of all-flash arrays down below that of arrays based on some spinning disk drives, Dell said.