Nasdaq

Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

The companies collaborated to deliver a comprehensive hierarchical thermal analysis solution for TSMC 3DFabric using RedHawk-SC Electrothermal TSMC enabled Ansys RedHawk-SC™ for power integrity (EM/IR ...
Seeking Alpha

Ansys Thermal and Multiphysics Solutions Certified for Intel 18A Process and 3D-IC Designs

PITTSBURGH, April 29, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) today announced thermal and multiphysics signoff tool certifications for designs manufactured with Intel 18A process technology. These ...
Business Insider

Samsung Foundry Certifies ANSYS Multiphysics Simulation Solutions For Multi-Die Integration Advanced Packaging Technology

PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...
Nasdaq

Ansys (ANSS), TSMC & Microsoft to Advance 3D-IC Stress Analysis

Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...
Semiconductor Engineering

Heat-Related Issues Impact Reliability In Advanced IC Designs

Heat is becoming a much bigger problem in advanced-node chips and packages, causing critical electrons to leak out of DRAM, timing and reliability issues in 3D-ICs, and accelerated aging that are ...
Seeking Alpha

Keysight, Synopsys, and Ansys Accelerate RFIC Semiconductor Design with New Reference Flow for TSMC's Most Advanced 4nm RF FinFET Process

New reference flow offers open, efficient radio frequency design solution that supports streamlined migration from previous process nodes Industry-leading electromagnetic simulation tools boost 5G/6G ...