In a fierce race with TSMC and Intel to develop next-generation chipmaking processes, Samsung Electronics is reportedly accelerating its adoption of BackSide Power Delivery Network (BSPDN) technology, ...

As TSMC and Intel announced in succession that they are conducting R&D for the back-side power delivery network (BSPDN) technology, Samsung Electronics recently shared the current development ...

Samsung has started providing more details about its backside power delivery network (BSPDN) roadmap, stating that its 2-nm process node will be optimized for this new technology when it enters mass ...

SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced it is collaborating with Rapidus Corporation to provide co-optimized AI-driven reference design flows and ...

TSMC won FinFET. All noteworthy leading edge logic designs, even Intel’s, are manufactured on TSMC’s N5 and N3 process in southern Taiwan. Competitors have been left in the dust. Samsung has had poor ...

With 2nm scheduled to enter mass production in 2H25, TSMC, at its North America Technology Symposium today, introduced more details on its next-gen advanced node, A14, which is expected to start ...

Rapidus 2HP is reported to reach a logic density of 237.31 MTr/mm², nearly matching TSMC's N2 at 236.17 MTr/mm², according to sources cited by the report. The report further highlights that both nodes ...

A new contract chipmaking technology, dubbed the backside power delivery network (BSPDN), will reduce the size of a 2-nanometer chip by 17%, compared with the traditional front-end power delivery ...

TSMC on Thursday reported its strongest quarter ever, posting a revenue of $30 billion for the second quarter of 2025, citing strong demand for AI processors. The foundry expects demand for AI ...

Use left and right arrow keys to seek audio. Apple isn't looking at moving to TSMC's bleeding-edge A16 process node anytime soon, even faster than the company had TSMC fab its new A20 and A20 Pro ...