Ironwood Electronics has released a spring pin socket for BGA500 devices intended for 23 x 23 mm packages with 0.5 mm pitch.

Advanced AI/CPU processors demand extreme high frequency and power performance from SLT and ATE test sockets. These sockets are in the critical path at the end of a very costly silicon fabrication and ...

For the first time, applications that require high-temperature device testing and burn-in, as well as those with high-frequency bandwidth, low inductance and high current conditions, can now ...

A technical paper titled “Fabrication and Characterization of Three-Dimensional Microelectromechanical System Coaxial Socket Device for Semiconductor Package Testing” was published by researchers at ...

Specifying test sockets for high-speed, high-pin-count custom ICs can put you in a Catch-22 situation. Suppose your pc-board design requires a test socket. You need the socket footprint to complete ...