In brief: While covering a wide range of topics during his keynote at Nvidia's GTC, CEO Jensen Huang briefly touched on the company's GPU roadmap beyond the upcoming Rubin architecture. The Feynman ...

The problem: As metal pitch scaling shrinks to support the next generation of logic devices, the IR (or voltage) drop from conventional frontside connections has become a major challenge [1,2]. As ...

Samsung may have led the 3nm race with its Gate-All-Around (GAA) process, but the production yields from this process have yet to meet satisfactory levels, if a new leak coming out of Korea is to be ...

Diffusing oxygen into 2D materials can improve adhesion properties. Channel-last processes can preserve most of the traditional gate-all-around process flow. Dual-gate MoS 2 FETs with graphene ...

Despite being the first to adopt the gate-all-around (GAA) technology, Samsung has struggled with commercialization and yield issues and its foundry market share has dropped below 10%. Han Jin-Man, ...