This article is a case study of a fast curing adhesive that can bond electronic components. The application, finding answers, solution, additional options, and summary of products are included in the ...

Master Bond Inc. single component EP17HT-3 epoxy adhesive cures in 2-3 minutes at 250-300°F. It requires no mixing and is capable of service up to 400°F. 100% reactive EP17HT-3 contains no solvents or ...

Master Bond LED422DC90 is a one component, nanosilica filled dual cure adhesive system engineered for high-speed fixturing and bonding of opaque substrates. This unique “side-bonding” capability ...

Master Bond Supreme 3DM-85 is a no mix, non-solvent based, one component epoxy. Forumlated to serve as a damming compound, the thixotropic paste material can also be utilized for bonding and sealing.

Electronic device design and production processes are experiencing an evolution. Devices are becoming increasingly more complex and smaller in size, with trends in functionalities and aesthetics ...