Indium Corporation announces the Heat-Spring®metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACKTMIGBT modules. Many ...
Indium Corporation ® is proud to introduce new, high-reliability Au-based Precision Die-Attach (PDA) Preforms. Compared to standard preforms, these gold-based PDA preforms offer a higher level of ...
As an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation ® will feature its advanced products designed to meet the evolving challenges of ...
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