AMD samples Class Y–targeted adaptive SoC with lidless organic package for 15-year GEO, cislunar, and deep-space onboard AI.
Programmable AI NIC for Ethernet: how AMD Pensando enables UEC, MRC, and MetaRoCE on Pollara 400 and Vulcano 800—flexible ...
AMD Ross agentic AI assistant spans software, silicon and board design to dramatically accelerate embedded system design, ...
AMD and Intel unify PyTorch x86 CPU optimization in oneDNN, merging ZenDNN into one open path and paving the way for ACE ...
Why physical AI requires a new definition of performance – one built around the whole system, not peak compute.
Acquisition adds AI-native microcontrollers and fusion processors to ADI's sensing, processing and connectivity portfolio.
Infinitesima refreshes its brand as advanced packaging and three-dimensional chip architectures increase measurement ...
T-Global will showcase thermal materials and cooling technologies at three European exhibitions targeting electronics, thermal management and aerospace industries.
Global smartphone SoC shipments declined by 21% YoY in 3Q 2026 amid rising memory costs, longer replacement cycles and ...
The demonstrations will cover 1.6T interconnect validation, AI-assisted design, RF testing, cybersecurity and EV charging.
Physical AI deployment depends on balancing computing performance, energy efficiency, system integration, safety and ...
WICOP 3 technology produces white light without rare earths or packaging, targeting lighting, AR displays and optical ...
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