IEEE

300-GHz-band metamaterial-based phase shifting integrated circuit in high-resolution 3D printed waveguide packaging for future wireless communication

Abstract: This study presents the first-ever phase shifter metamaterial-based devices at 300- GHz-band with continuous 2π phase controllability for future beamforming in wireless networks. To cope ...
IEEE

Process Challenges in Thin Wafers Fabrication with Double Side Hybrid Bond Pads for Chip Stacking

Abstract: 3D packaging with stacked dies is widely explored as a future advanced packaging technology for applications involving high-performance computing and High Bandwidth Memory (HBM) devices. In ...
Semiconductor Engineering

Six 3D-IC Design Trends That Secure The AI Era

Greater functionality, performance, and speed are in great demand in pervasive computing, RF, and automotive electronic systems, as well as most everything else. Complexity continues to skyrocket, ...
Fudzilla

SMIC hunting for packaging magic

China’s biggest foundry, SMIC, wants tighter ties with the testing crowd, hoping backend tricks can do what lithography won’t. The company appears to have hit a wall on transistor scaling, so it is ...
Future Market Insights

Chiplet Architectures and Advanced Packaging Redefine the U.S. Semiconductor Assembly and Testing Industry

The semiconductor assembly and testing service industry is undergoing a structural transformation—and at the center of it is the United States. As traditional monolithic chip scaling runs into ...