SE: AI is disruptive to EDA, the semiconductor industry, and to their customers. One early indication is that computer ...

Autonomous machines promise to transform industries, but memory bottlenecks, power constraints, specialized architectures, ...

The first step in right-sizing an AI model for an embedded application is determining its purpose, including the target ...

Shared resources, a mix of tools running at different speeds, and multiple dies are adding new challenges for design teams.

How data center operators can protect critical data and communications without compromising the performance demanded by distributed AI and HPC workloads.

Chiplets for physical AI; rack-level considerations; verification complexity; sparse matrix workloads; AI data centers.

Who verifies the verifier? This is the age-old question for anyone involved in the verification of semiconductor systems. Who ...

Technology is only useful if it improves an existing methodology. Property generation is still refining that goal, but in the ...

Physics-based analysis becomes more consequential as chips, packages, boards, and systems are designed together.

Meter-scale quantum interconnects; 2.5D/3D GPU integration and embodied emissions; secure memory-dependent prefetching; routing-aware analog placement; AI-enhanced flip-chip defect detection; ...

Researchers at Chinese Academy of Sciences, Jilin University, State Key Laboratory of Advanced Manufacturing for Optical ...

Advanced packaging requires models to cross company boundaries without exposing proprietary processes, but hiding too much ...