Winbond's new CUBE-Lite memory solution delivers up to 8GB/s bandwidth at approximately 70mW, targeting wearables, AI imaging ...

A2 Global Electronics has achieved AS9100 certification, expanding its quality management framework for component processing, ...

VocalFusion XVF3800 voice processor from XMOS. The device integrates far-field voice processing for up to four digital microphones in a single device, providing acoustic echo cancellation (AEC), ...

Global semiconductor sales climbed to $517.7 billion in Q3 2026, with September sales reaching $172.6 billion as all major ...

Infineon Technologies AG radiation-hardened HiRel power devices are aboard the Nancy Grace Roman Space Telescope, which lifted off from Kennedy Space Centre in Florida, marking the successful launch ...

The PLC is the brain that runs machines, processes and installations. Ardbox Q adds the ability to analyse what happens with AI in a single device. Industrial Shields, a manufacturer of industrial ...

Qt Group has unveiled Clate, a new AI-powered design environment for embedded interfaces, combining no-code development, ...

TRF2001 multiprotocol RF FEM from Texas Instruments. The device is a high-performance ISM-band multiprotocol and Wi-SUN FEM for low-power wireless applications in the sub-1GHz band. Typical ...

Delivering up to 34 TOPS of total platform AI performance, with support for AI acceleration module expansion; Darveen has launched the DPC-1210 Industrial Panel PC, powered by the ...

Next-generation fixed optical gas imaging solution combines continuous monitoring with enhanced detection, analytics, and versatile camera options Teledyne FLIR has introduced new capabilities for its ...

TE Connectivity's HC-STAK 35 high-voltage interconnection system is now available from Mouser, offering 400A current handling ...

Fly-Wing Technologies will attend electronica 2026 in Munich, highlighting global electronic component sourcing, hard-to-find ...