Abstract: Dependency of asymmetric etched profiles on open-ratio and pattern-size within the wafer was studied in a magnetic Very High Frequency (VHF) Plasma etching system for high aspect-ratio ...

Abstract: Wafer-level quartz dry etching technology has been developed, which enables deep reactive ion etching (DRIE) for through-etch of ≥120-μm-thick crystal quartz wafers and an X-cut quartz DRIE.

At least 67,800 years ago, someone placed their hand on the wall inside a limestone cave and used a reddish-brown pigment to trace the outline of a handprint. But the unknown artist didn’t stop there: ...