A full scale mock-up of the GCAP was displayed at the Farnborough International Airshow 2026. The consortium responsible for delivering the powerplant has reported good progress towards the ...
Abstract: As integrated circuits evolve towards higher density, reduced line width, and finer interconnect pitch, the significance of maintaining robust power integrity (PI) and signal integrity (SI) ...
Abstract: Wafer level reliability is a key tool for the development of new technologies, since it enables to anticipate the lifetime of these technologies in operating conditions. In this paper, we ...
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